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ACKNOWLEDGMENT: Move2THz is supported by the Chips Joint Undertaking and its members, including the top-up funding by National Authorities under Grant Agreement n° 101139842.
Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or the granting authority. Neither the European Union nor the granting authority can be held responsible for them.
Photos © Christophe LEPETIT
Move2THz has officially started
We are thrilled to announce that our European Chips Joint Undertaking project, Move2THz has officially started on the 1st of June 2024!
This project is breaking a frequency wall to enable industry-viable next-generation applications by providing a sustainable technology platform & related ecosystem covering the entire value chain. Together with 27 partners and the Coordinator SOITEC in a front row, we will radically innovate the manufacturing process by establishing a breakthrough Indium Phosphide-on-Silicon (InPoSi) global standard.
Why do we need this technology upgrade? ➡ Electronic devices have evolved significantly, fuelling the digital transformation towards a connected society. The growing need for performance, speed, and efficiency pushes wireless applications to operate at sub-THz frequencies and beyond. A disruptive yet commercially viable technology is urgently needed. Project will radically innovate the manufacturing process by establishing a breakthrough InP-on-silicon (InPoSi) global standard. This facilitates to upscale the wafer size & volume compatible with CMOS manufacturing capacities, while minimizing the use of rare InP resources and ecological footprint.
Follow our three-year journey beyond 5G and towards the THz era!
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Best regards,
Move2THz team
