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ACKNOWLEDGMENT: Move2THz is supported by the Chips Joint Undertaking and its members, including the top-up funding by National Authorities under Grant Agreement n° 101139842.
Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or the granting authority. Neither the European Union nor the granting authority can be held responsible for them.
Photos © Christophe LEPETIT
Project team presenting in EuMW workshop "Key Enabling Technologies..."
Move2THz team was a part of the workshop "Key Enabling Technologies for Future Wireless, Wired, Optical & Satcom Applications" in the European Microwave Week 2024, Paris.
The project was mentioned by our coordinator, Francois Brunier (SOITEC), in his presentation about "Advanced Substrates Technologies for Sub-THz Era." A deep exploration of cutting-edge advancements shaping the wireless landscape.
Also, many thanks for participating to our team members: Pascal Chevalier (STMicroelectronics) and Yvan Morandini (Soitec). Especially for Björn Debaillie (imec), who was co-chairing the workshop and organizing the event.
Organizers about the workshop:
"The ever-expanding demand of our interconnected world drives the global innovation of future communication systems and technologies. As our reliance on digital communication grows, there is a pressing requirement for systems that can accommodate increasing data traffic, provide faster and more reliable connectivity, and support a diverse range of applications in a sustainable way. Moving towards higher frequency bands (mm-wave and sub-THz) and more disruptive technologies, using heterogeneous integration of (Bi)CMOS, SOI, and III/V components such as GaN or InP, and advanced packaging techniques will be necessary to realize the objectives of ubiquitous, ultra-high bandwidth and low latency
networks. This workshop presents the latest research roadmaps and realisations from the European ecosystem (industry, research and academia) enabling the development of future wireless, wired and satcom applications utilizing the mm-wave and sub-THz bands.
We cover the entire value chain, comprising technologies, devices, characterization, architectures, circuits, 3D heterogeneous integration and packaging. We will leverage and establish synergetic interactions from/between European CHIPS JU projects SHIFT and Move2THz, the 3D heterogenous integration and packaging community and the MTT-TC9 society. With this workshop, we aim to stimulate synergetic research on advanced communication systems which become integral to driving economic growth, fostering innovation, and ensuring global connectivity that is both efficient and accessible to all."
Full program and description here: https://www.eumweek.com/docs/2024_programme.pdf
Best wishes,
Move2THz team
